In order to ensure a high quality in the prototype manufacturing the laboratory is equipped with a wide range of state of the art equipment as listed below:
A1 heavy wire wedgebonder
- Pull & Shear test. Al wedge wirebonding for power interconnects. Modular wirebond head replaceable with pulltest or sheartest head. Al heavy wires with Ø250-500 micron.
Ultrasonic welder
- allows ultrasonic welding of attaching robust high current Cu power terminals to the DBC hybrid circuits.
Vacuum Vapour Phasesoldering system
Vapour phase reflow soldering system. Combined with the built-in vacuum module the soldering system provides voidfree and reliable soldering of dies and DBC- baseplate stacks.
Chemical Wet stations for surface preparation, deposition and cleaning
Yellow light conditions on demand for photosensitive processes such as photoresist spincoating, development etc.
Workstation for clean assembly and handling
A dustfree laminar flow workstation for dust sensitive process steps such as solder application and die placement.
Vacuum chamber facilities
Degassing of encapsulant gels or epoxies before and after for potting of final modules to eliminate bubbles in encapsulants.
Material sample preparation for microscopy
Diamond cutting and polishing to make sections of modules and power components (Si IGBTS, SiC MOSFETS, GaN HEMT etc).
