The main part of the research in the power electronics packaging, materials and emerging applications is carried out the following laboratory facilities.
Power electronics packaging
The power module packaging laboratory enables fast prototyping of novel power module layouts and the exploration of physical mechanisms and processes involved in power module packaging as well as embedding of relevant probes into the design. Medium voltage power module prototypes utilizing 10kV SIC MOSFETSas well as custom test samples were already demonstrated in the lab. Continuous process optimization is being pursued and efforts will be extended in the future to implement emerging packaging materials and processes.
Power Electronics component analysis laboratory
The laboratory is a state-of-the-art facility for characterizing and analysis of power modules, discrete transistors and similar power electronics components. The lab is used in post-production quality control for power electronics packaging activities at AAU. It furthermore facilitates the creation of static and dynamic models of power semiconductors.
In reliability studies, pre- and post-stress analysis of power semiconductors can quantify the impact of stressor on the performance of the device under test. Non-destructive analysis methods can be used to monitor the wear-out of the DUT during the lifetime tests.
Power Electronics systems laboratory
The power electronics system laboratory is used for testing prototypes from small power electronic converters up to large scale medium voltage complex systems. The laboratory provides the possibility of working at high voltage (up to 15 kV) and high power. It contains four 2.5×3.5m test cages with protection circuits. Each cage has two 16A and one 32A three phase connection. Water cooling is accessible in all of the cages. 125A 400V connection and high capacity water cooling system is available in one of the cages. Cages can be coupled together if a bigger work area is necessary.